Mechanics of Microelectronics

From the contents

1. Microelectronics technology

2. Reliability practices

3. Thermal Management

4. Introduction to Advanced Mechanics

5. Thermo-Mechanics of Integrated Circuits and Packages

6. Characterization and Modeling of Moisture Behavior

7. Characterization and Modeling of Solder Joint Reliability

8. Virtual thermo-mechanical prototyping

9. Challenges and future perspectives

From the reviews:"This is an introductory treatise on the mechanism of microelectronics that has penetrated into every aspects of human life for the past half of a century. ... The treatise should be of interest to both the academia and industry, and it can be used as a 'basic source for teaching' in a graduate course. ... In sum, the authors have done a valuable service in presenting the title topic to researchers, engineers and students interested in the mechanics of microelectronics." (M. Cengiz Dökmeci, Zentralblatt MATH, Vol. 1105 (7), 2007)"The editors of Mechanics of Microelectronics present this book, as their obligation, to graduate students in universities, researchers, engineers and managers in industries. ... The book chapters are written by the worldwide leading experts with both profound theoretical achievement and rich industrial experience ... . The book will be eagerly sought after by microelectronics and microsystems design engineers; process/product development engineers; reliability engineers; thermal, mechanical and multi-physics analysts; researchers, graduates and PhD students and their guides." (Current Engineering Practice, 2007)