Surface Mount Technology with Fine Pitch Components
The manufacturing issues
(Sprache: Englisch)
This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.
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Klappentext zu „Surface Mount Technology with Fine Pitch Components “
This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.
Inhaltsverzeichnis zu „Surface Mount Technology with Fine Pitch Components “
Foreword. Introduction. Economic aspects of manufacturing. Driving forces in electronics. Basic properties of solder materials. Printing of solder pastes for fine pitch components. The printing process. The soldering process. Parameters influencing soldering results. Optimization of soldering results. Design related manufacturing problems. Manufacturing problems specific to fine pitch components. Soldering process influence on component reliability. Limitations of current surface mounting technology and new packages types. Future manufacturing technologies.
Bibliographische Angaben
- Autor: H. Danielsson
- 1994, 260 Seiten, Maße: 16 x 24,1 cm, Gebunden, Englisch
- Verlag: Springer US
- ISBN-10: 0412553406
- ISBN-13: 9780412553400
- Erscheinungsdatum: 30.11.1994
Sprache:
Englisch
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