Chips 2020.Vol.2

News on 8 Chip-Technologies.- Monolithic 3D Integration.- Comprehensive, Reliable, Low-Power Electronics.- Analog for a Digital World.- Interconnects, Communication.- Developments in the Chip Market.- ITRS, The 2014-2029 International Technology Roadmap of Semiconductors.- Nanolithography.- Power-Efficient Design.- Super processors and Super computers.- Memory.- Hybrid 3D Integration for Wireless Multimedia.- Technology for the Next-Generation Mobile User.- MEMS -Micro-Electromechanical Systems.- Vision Chips and Cameras.- Digital Neural Networks.- Retinal Implants.- The Human-Brain Projects.- Energy Harvesting and Chip Autonomy.- 2020 World with Chips.

Bernd Höfflinger has a lifelong career with semiconductor chips. After starting at Siemens Research, he was invited to join the faculty at Cornell University, where he set up and taught the first graduate course on integrated circuits (IC s). He continued as the first product manager for MOS IC s, Siemens, Munich. With that experience, he became a co-founder of the University of Dortmund, where he built the first public pilot line for IC s in Europe, which realized the world s first all-ion-implanted Bipolar-CMOS process. As Head of the Electrical Engineering Departments at the University of Minnesota and at Purdue University, he led the major expansions of their electronics programs. He was invited back to Germany to build and lead the Institute for Microelectronics Stuttgart. As a public enterprise for contract R&D, it became one of the first certified manufacturing lines in Europe for CMOS Application-Specific Circuits. It has become the world leader in the development and manufacture of test masks for every next-generation lithography since the 1990's. Bernd Höfflinger has been the recipient or co-recipient of numerous scientific and best-product awards. He is a member of the Dusseldorf Academy of Sciences

"CHIPS 2020 Volume 2 has sought to present the latest developments in the most critical and promising areas relevant to energy efficient electronics. ... This book is suitable for the student, researcher or recent graduate that wants to understand where the challenges lie in chips and for managers, investors and policy makers. It is suitable for all and is written with the issue of sustainability and engineering responsibility at its core." (EETimes Europe Analog, analog-eetimes.com, November, 2015)