Circuits and Systems for Future Generations of Wireless Communications
(Sprache: Englisch)
The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today and the future will...
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The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection with many other devices rather than with a single base station, in a variety of environments. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required.
In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.
In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.
Klappentext zu „Circuits and Systems for Future Generations of Wireless Communications “
The idea for this book originated from a Special Session on Circuits and Systems for Future Generations of Wireless Communications that was presented at the 2005 InternationalSymposiumon Circuits and Systems, which was then followed by two Special Issues bearing the same title that appeared in the March and April 2008 issues of the IEEE Transactions on Circuits and Systems - Part II: Express Briefs. Out of a large number of great contributions, we have selected those tting best the book format based on their quality. We would like to thank all the authors, the reviewers of the Transactions on Circuits and Systems - Part II, and the reviewers of the nal book material for their efforts in creating this manuscript. We also thank the Springer Editorial Staff for their support in putting together all the good work. We hope that this book will provide you, the reader, with new insights into Circuits and Systems for Future Generations of Wireless Communications.
Inhaltsverzeichnis zu „Circuits and Systems for Future Generations of Wireless Communications “
1. Introduction 2. Multi-Mode Radio - System Contribution; J. Groe 3. Reconfigurable Multi-Band OFDM UWB Receivers; L. Baldini, D. Manstreta, T. Erseghe, N. Laurenti, A. Liscidini, R. Castelo 4. Low Power UWB Circuits Front-end Building Blocks; T. Tsang, K.-Y. Lin, K.Allidina, M. El-Gamal 5. CMOS IR-UWB Transceiver System Design for Contact-less Chip Testing Applications; Y. Wang, A.M. Niknejad, V. Gaudet, K. Iniewski 6. Multi-Mode Power Amplifiers for Wireless Handset Applications; J. Deng, L. Larson 7. Polyphase Multipath Circuits for Cognitive Radio and Flexible Multi-phase Clock Generation; E. Klumperink, X. Gao, B. Nauta 8. IIP2 Improvement Techniques for Multi-Standard Mobile Radio; M. Vahidfar, O. Shoaei 9. Multi-Standard Continuous-time Sigma-Delta Converters for 4G Radios; Y. Ke, J. Craninckx, G. Gielen 10. Power Efficient Reconfigurable Baseband Filters for Multi-mode Radios; P. Crombez, J. Craninckx, M. Steyaert 11. An Adaptive Digital Front-End for Multi-Mode Wireless Receivers; G. Hueber, R. Stuhlberger, A. Springer 12. FEC Decoders for Future Wireless Devices - Scalability Issues and Multi-Standard Capabilities; J. Dielissen, N. Engin, S. Sawitzki, K. Van Berkel
Autoren-Porträt
Aleksandar Tasic: Qualcomm Incorporated, San Diego, California, USA, atasic@qualcomm.com
Wouter A. Serdijn: Department of Microelectronics, Electronics Research Laboratory, Delft University of Technology, Delft, the Netherlands, w.a.serdijn@tudelft.nl
Lawrence E. Larson: Radio Frequency Integrated Circuits Group University of California San Diego, La Jolla, CA, USA, larson@ece.ucsd.edu
Gianluca Setti: Department of Engineering (ENDIF), University of Ferrara Advanced Research Center on Electronic Systems (ARCES), University of Bologna, gianluca.setti@unife.it
Bibliographische Angaben
- 2009, 306 Seiten, Maße: 16,4 x 24,6 cm, Gebunden, Englisch
- Herausgegeben: Aleksandar Tasic, Wouter A. Serdijn, Gianluca Setti
- Verlag: Springer Netherlands
- ISBN-10: 1402099185
- ISBN-13: 9781402099182
Sprache:
Englisch
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