ESD Basics (PDF)
From Semiconductor Manufacturing to Product Use
(Sprache: Englisch)
Electrostatic discharge (ESD) continues to impact semiconductor
manufacturing, semiconductor components and systems, as
technologies scale from micro- to nano electronics. This book
introduces the fundamentals of ESD, electrical overstress...
manufacturing, semiconductor components and systems, as
technologies scale from micro- to nano electronics. This book
introduces the fundamentals of ESD, electrical overstress...
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Electrostatic discharge (ESD) continues to impact semiconductor
manufacturing, semiconductor components and systems, as
technologies scale from micro- to nano electronics. This book
introduces the fundamentals of ESD, electrical overstress (EOS),
electromagnetic interference (EMI), electromagnetic compatibility
(EMC), and latchup, as well as provides a coherent overview of the
semiconductor manufacturing environment and the final system
assembly. It provides an illuminating look into the integration of
ESD protection networks followed by examples in specific
technologies, circuits, and chips.
The text is unique in covering semiconductor chip manufacturing
issues, ESD semiconductor chip design, and system problems
confronted today as well as the future of ESD phenomena and
nano-technology.
Look inside for extensive coverage on:
* The fundamentals of electrostatics, triboelectric charging, and
how they relate to present day manufacturing environments of
micro-electronics to nano-technology
* Semiconductor manufacturing handling and auditing processing to
avoid ESD failures
* ESD, EOS, EMI, EMC, and latchup semiconductor component and
system level testing to demonstrate product resilience from human
body model (HBM), transmission line pulse (TLP), charged device
model (CDM), human metal model (HMM), cable discharge events (CDE),
to system level IEC 61000-4-2 tests
* ESD on-chip design and process manufacturing practices and
solutions to improve ESD semiconductor chip solutions, also
practical off-chip ESD protection and system level solutions to
provide more robust systems
* System level concerns in servers, laptops, disk drives, cell
phones, digital cameras, hand held devices, automobiles, and space
applications
* Examples of ESD design for state-of-the-art technologies,
including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS
(HVCMOS), RF CMOS, smart power, magnetic recording technology,
micro-machines (MEMs) to nano-structures
ESD Basics: From Semiconductor Manufacturing to Product
Use complements the author's series of books on ESD
protection. For those new to the field, it is an essential
reference and a useful insight into the issues that confront modern
technology as we enter the Nano-electronic Era.
manufacturing, semiconductor components and systems, as
technologies scale from micro- to nano electronics. This book
introduces the fundamentals of ESD, electrical overstress (EOS),
electromagnetic interference (EMI), electromagnetic compatibility
(EMC), and latchup, as well as provides a coherent overview of the
semiconductor manufacturing environment and the final system
assembly. It provides an illuminating look into the integration of
ESD protection networks followed by examples in specific
technologies, circuits, and chips.
The text is unique in covering semiconductor chip manufacturing
issues, ESD semiconductor chip design, and system problems
confronted today as well as the future of ESD phenomena and
nano-technology.
Look inside for extensive coverage on:
* The fundamentals of electrostatics, triboelectric charging, and
how they relate to present day manufacturing environments of
micro-electronics to nano-technology
* Semiconductor manufacturing handling and auditing processing to
avoid ESD failures
* ESD, EOS, EMI, EMC, and latchup semiconductor component and
system level testing to demonstrate product resilience from human
body model (HBM), transmission line pulse (TLP), charged device
model (CDM), human metal model (HMM), cable discharge events (CDE),
to system level IEC 61000-4-2 tests
* ESD on-chip design and process manufacturing practices and
solutions to improve ESD semiconductor chip solutions, also
practical off-chip ESD protection and system level solutions to
provide more robust systems
* System level concerns in servers, laptops, disk drives, cell
phones, digital cameras, hand held devices, automobiles, and space
applications
* Examples of ESD design for state-of-the-art technologies,
including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS
(HVCMOS), RF CMOS, smart power, magnetic recording technology,
micro-machines (MEMs) to nano-structures
ESD Basics: From Semiconductor Manufacturing to Product
Use complements the author's series of books on ESD
protection. For those new to the field, it is an essential
reference and a useful insight into the issues that confront modern
technology as we enter the Nano-electronic Era.
Autoren-Porträt von Steven H. Voldman
Dr. Steven H. Voldman, IEEE Fellow, Vermont, USA. Prolific Wiley writer, Dr. Steven Voldman has been involved with ESD work since 1991. He has been Chairman of the ESD Association WG 5.5 on TLP testing since 2001 and he was Chairman of the SEMATECH ESD Working Group on ESD Technology from 1995 until 1998.Dr. Voldman worked 25 years at IBM before working at Qimonda in 2007 and then TSMC Corporation in 2008. Currently he holds 181 patents in the areas of ESD and latchup, and has 125 pending. His fields of expertise are electrostatic discharge (ESD) protection, latchup, ESD testing and ESD design. To date, he has worked on many design architectures from SRAM, DRAM, ASICs, Microprocessors, NVRAMs, image processing designs and power technology.
Bibliographische Angaben
- Autor: Steven H. Voldman
- 2012, 1. Auflage, 250 Seiten, Englisch
- Verlag: John Wiley & Sons
- ISBN-10: 1118443276
- ISBN-13: 9781118443279
- Erscheinungsdatum: 23.08.2012
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
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Sprache:
Englisch
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