Machine Learning in VLSI Computer-Aided Design (PDF)

Springer books: "3D Stacked Chips: From Emerging Processes to Heterogeneous Systems," 2016, and "The IoT Physical Layer: Design and Implementation," 2019. From 2009 to 2013, Dr. Elfadel served as an Associate Editor of the IEEE Transactions on Computer-Aided Design. He is currently serving as Associate Editor of the IEEE Transactions on VLSI Systems and on the Editorial Board of the Microelectronics Journal (Elsevier). Dr. Elfadel has also served on the Technical Program Committees of several leading conferences, including DAC, ICCAD, ASPDAC, DATE, ICCD, ICECS, and MWSCAS. Most recently, he was the General Co-chair of the IFIP/IEEE 25th International Conference on Very Large Scale Integration (VLSI-SoC 2017), Abu Dhabi, UAE. He received his PhD from MIT in 1993.

Duane S. Boning is the Clarence J. LeBel Professor in Electrical Engineering, and Professor of Electrical Engineering and Computer Science in theEECS Department at MIT. He is affiliated with the MIT Microsystems Technology Laboratories, and serves as MTL Associate Director for Computation and CAD. From 2004 to 2011, he served as Associate Head of the EECS Department at MIT, from 2011 through 2013 as Director/Faculty Lead of the MIT Skoltech Initiative, and from 2011 to 2018 as Director of the MIT/Masdar Institute Cooperative Program. He is currently the Engineering Faculty Co-Director of the MIT Leaders for Global Operations (LGO) program. Dr. Boning received his S.B. degrees in electrical engineering and in computer science in 1984, and his S.M. and Ph.D. degrees in electrical engineering in 1986 and 1991, respectively, all from the Massachusetts Institute of Technology. He was an NSF Fellow from 1984 to 1989, and an Intel Graduate Fellow in 1990. From 1991 to 1993 he was a Member Technical Staff at the Texas Instruments Semiconductor Process and Design Center in Dallas, Texas, where he worked on semiconductor process representation, process/device simulation tool integration, and statistical modeling and optimization. Dr. Boning is a Fellow of the IEEE, and has served as Editor in Chief for the IEEE Transactions on Semiconductor Manufacturing. He is a member of the IEEE, Electrochemical Society, Eta Kappa Nu, Tau Beta Pi, Materials Research Society, Sigma Xi, and the Association of Computing Machinery.

Xin Li received the Ph.D. degree in Electrical & Computer Engineering from Carnegie Mellon University in 2005. He is currently a Professor in the ECE Department at Duke University and is leading the Institute of Applied Physical Sciences and Engineering and the Data Science Research Center at Duke Kunshan University. His research interests include integrated circuit, signal processing and data analytics. Dr. Li is the Deputy Editor-in-Chief of IEEE TCAD. He was an Associate Editor of IEEE TCAD, IEEE TBME, ACM TODAES, IEEE D&T and IET CPS. He was the General Chair of ISVLSI and FAC. He received the NSF CAREER Award in 2012 and six Best Paper Awards from IEEE TCAD, DAC, ICCAD and ISIC. He is a Fellow of IEEE.