3-D Integrated Circuit Design
(Sprache: Englisch)
With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design)...
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Klappentext zu „3-D Integrated Circuit Design “
With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future.This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.
Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers
The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find
Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D
Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits
Inhaltsverzeichnis zu „3-D Integrated Circuit Design “
Chapter 1. IntroductionChapter 2. Manufacturing of 3-D Packaged Systems
Chapter 3. 3-D Integrated Circuit Fabrication Technologies
Chapter 4. Interconnect Prediction Models
Chapter 5. Physical Design Techniques for 3-D ICs
Chapter 6. Thermal Management Techniques
Chapter 7. Timing Optimization for Two-Terminal Interconnects
Chapter 8. Timing Optimization for Multi-Terminal Interconnects
Appendix A: Enumeration of Gate Pairs in a 3-D IC
Appendix B: Formal Proof of Optimum Single Via Placement
Appendix C: Proof of the Two-Terminal Via Placement Heuristic
Appendix D: Proof of Condition for Via Placement of Multi-Terminal Nets
References
Autoren-Porträt von Eby G. Friedman, Vasilis F. Pavlidis
Eby G. Friedman received the B.S. degree from Lafayette College in 1979, and the M.S. and Ph.D. degrees from the University of California, Irvine, in 1981 and 1989, respectively, all in electrical engineering.From 1979 to 1991, he was with Hughes Aircraft Company, rising to the position of manager of the Signal Processing Design and Test Department, responsible for the design and test of high performance digital and analog integrated circuits. He has been with the Department of Electrical and Computer Engineering at the University of Rochester since 1991, where he is a Distinguished Professor, and the Director of the High Performance VLSI/IC Design and Analysis Laboratory. He is also a Visiting Professor at the Technion - Israel Institute of Technology. His current research and teaching interests are in high performance synchronous digital and mixed-signal microelectronic design and analysis with application to high speed portable processors, low power wireless communications, and power efficient server farms.
He is the author of more than 500 papers and book chapters, 13 patents, and the author or editor of 18 books in the fields of high speed and low power CMOS design techniques, 3-D integration, high speed interconnect, and the theory and application of synchronous clock and power delivery and management. Dr. Friedman is the Editor-in-Chief of the Microelectronics Journal, a Member of the editorial board of the Journal of Low Power Electronics and Journal of Low Power Electronics and Applications, and a Member of the technical program committee of numerous conferences. He previously was the Editor-in-Chief and Chair of the Steering Committee of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems, the Regional Editor of the Journal of Circuits, Systems and Computers, a Member of the editorial board of the Proceedings of the IEEE, IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing, IEEE Journal on Emerging and
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Selected Topics in Circuits and Systems, Analog Integrated Circuits and Signal Processing, and Journal of Signal Processing Systems, a Member of the Circuits and Systems (CAS) Society Board of Governors, Program and Technical chair of several IEEE conferences, and a recipient of the IEEE Circuits and Systems 2013 Charles A. Desoer Technical Achievement Award, a University of Rochester Graduate Teaching Award, and a College of Engineering Teaching Excellence Award. Dr. Friedman is an inaugural member of the University of California, Irvine Engineering Hall of Fame, a Senior Fulbright Fellow, and an IEEE Fellow.
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Bibliographische Angaben
- Autoren: Eby G. Friedman , Vasilis F. Pavlidis
- 2008, 336 Seiten, 100 Abbildungen, Maße: 19,7 x 24,3 cm, Gebunden, Englisch
- Verlag: Morgan Kaufmann
- ISBN-10: 0123743435
- ISBN-13: 9780123743435
- Erscheinungsdatum: 12.11.2008
Sprache:
Englisch
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