3D and Circuit Integration of MEMS

PART I INTRODUCTION 1 OVERVIEW PART II SYSTEM ON CHIP 2. BULK MICROMACHINING 2.1 Process Basis of Bulk Micromachining Technologies 2.2 Bulk micromachining based on wafer bonding 2.3 Single wafer single side processes 3. ENHANCED BULK MICROMACHINING BASED ON MIS PROCESS 3.1 Repeating MIS cycle for multi-layer 3D structure or multi-sensor integration 3.2 Pressure sensor fabrication - - from MIS updated to TUB 3.3 Extension of MIS process for various advanced MEMS devices 4. EPITAXIAL POLY SI SURFACE MICROMACHINING 4.1 Process condition of epi-poly Si 4.2 MEMS devices using epi-poly Si 5. POLY SIGE SURFACE MICROMACHINING 5.1 Introduction 5.2 SiGe deposition 5.3 LP CVD polycrystalline SiGe 5.4 CMEMS¿ process 5.5 Poly-SiGe applications 6. METAL SURFACE MICROMACHINING 6.1 Background of Surface Micromachining 6.2 Static device 6.3 Static structure fixed after the single movement 6.4 Dynamic device 6.5 Summary 7. HETEROGENEOUSLY INTEGRATED ALUMINUM NITRIDE MEMS RESONATORS AND FILTERS 7.1 Overview of integrated aluminum nitride MEMS 7.2. Heterogeneous integration of aluminum nitride MEMS resonators with CMOS circuits 7.3 Heterogeneously integrated self-healing filters 8. MEMS USING CMOS WAFER 8.1 Introduction : CMOS MEMS architectures and advantages 8.2 Process modules for CMOS MEMS 8.3 The 2P4M CMOS platform (0.35µm) 8.4 The 1P6M CMOS platform (0.18µm) 8.5 CMOS MEMS with add-on materials 8.6 Monolithic integration of circuits and sensors 8.7 Issues and Concerns 8.8 Concluding remarks 9. WAFER TRANSFER 9.1 Introduction 9.2 Film transfer 9.3 Device transfer (Via-last) 9.4 Device transfer (via-first) 9.5 Chip level transfer 10. PIEZOELECTRIC MEMS 10.1 Introduction 10.2 PZT thin film deposition 10.3 PZT-MEMS fabrication process PART III BONDING, SEALING AND INTERCONNECTION 11. ANODIC BONDING 11.1 Principle 11.2 Distortion 11.3 Influence of anodic bonding to circuits 11.4 Anodic bonding with various materials, structures and conditions 12. DIRECT BONDING 12.1 Wafer direct

Masayoshi Esashi is Professor in the Micro System Integration Center at Tohoku University, Japan. He obtained his PhD from Tohoku University and has been working there as a researcher and teacher. His research interests include MEMS, integrated sensors and MEMS packaging. He has published more than 500 scientific papers and has received numerous awards including the IEEE Andrew S. Grove Award in 2015 and IEEE Jun-ichi Nishizawa medal in 2016.