Chemical-Mechanical Planarization of Semiconductor Materials
(Sprache: Englisch)
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics...
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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Klappentext zu „Chemical-Mechanical Planarization of Semiconductor Materials “
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Inhaltsverzeichnis zu „Chemical-Mechanical Planarization of Semiconductor Materials “
1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.
Bibliographische Angaben
- 2004, 428 Seiten, 298 Abbildungen, Maße: 16 x 24,1 cm, Gebunden, Englisch
- Herausgegeben:Oliver, M.R.
- Herausgegeben: M. R. Oliver
- Verlag: Springer
- ISBN-10: 3540431810
- ISBN-13: 9783540431817
- Erscheinungsdatum: 26.01.2004
Sprache:
Englisch
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