Design for Manufacturability
From 1D to 4D for 90-22 nm Technology Nodes
(Sprache: Englisch)
This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide...
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This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.
Inhaltsverzeichnis zu „Design for Manufacturability “
Preface.- Classic DfM: from 2D to 3D.- DfM at 28 nm and Beyond.- New DfM Domain: Stress Effects.- Conclusions and Future Work.Autoren-Porträt von Artur Balasinski
Artur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California.
Bibliographische Angaben
- Autor: Artur Balasinski
- 2016, Softcover reprint of the original 1st ed. 2014, VIII, 278 Seiten, 45 farbige Abbildungen, Maße: 15,5 x 23,6 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 1493943421
- ISBN-13: 9781493943425
Sprache:
Englisch
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