Electrochemistry of Metal Complexes
Applications from Electroplating to Oxide Layer Formation
(Sprache: Englisch)
A systematic analysis of electrochemical processes involving metal complexes.
Starting with general considerations on equilibria in solutions and at interfaces as well as on mass transport, the text acquaints readers with the theory and common...
Starting with general considerations on equilibria in solutions and at interfaces as well as on mass transport, the text acquaints readers with the theory and common...
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A systematic analysis of electrochemical processes involving metal complexes.
Starting with general considerations on equilibria in solutions and at interfaces as well as on mass transport, the text acquaints readers with the theory and common experimental practice for studying electrochemical reactions of metals complexes. The core part of the book deals with all important aspects of electroplating, including a systematic discussion of co-deposition of metals and formation of alloys. It also discusses such related subjects as oxide layer formation and hydrogen evolution as a side reaction.
Starting with general considerations on equilibria in solutions and at interfaces as well as on mass transport, the text acquaints readers with the theory and common experimental practice for studying electrochemical reactions of metals complexes. The core part of the book deals with all important aspects of electroplating, including a systematic discussion of co-deposition of metals and formation of alloys. It also discusses such related subjects as oxide layer formation and hydrogen evolution as a side reaction.
Klappentext zu „Electrochemistry of Metal Complexes “
A systematic analysis of electrochemical processes involving metal complexes. Starting with general considerations on equilibria in solutions and at interfaces as well as on mass transport, the text acquaints readers with the theory and common experimental practice for studying electrochemical reactions of metals complexes. The core part of the book deals with all important aspects of electroplating, including a systematic discussion of co-deposition of metals and formation of alloys. It also discusses such related subjects as oxide layer formation and hydrogen evolution as a side reaction.
Inhaltsverzeichnis zu „Electrochemistry of Metal Complexes “
INTRODUCTION Symbols and AbbreviationsEQUILIBRIUM PROPERTIES OF COMPLEX SYSTEMS General Definitions Equilibria in the Solutions of Complex CompoundsDistribution of Complexes and Ligands in SolutionEQUILIBRIUM ELECTRODE POTENTIALSElectrodes of the First KindEquilibria Involving IntermediatesElectrodes of the Second KindOpen-Circuit Potentials. Examples of Experimental InvestigationsSystem Cu/Cu(I), CN-System Cu/Cu(II), beta-alanineHALF-WAVE POTENTIALSAnalysis of Reversible PolarogramsIrreversible PolarogramsQuasi-Reversible PolarogramsMASS TRANSPORT Two Models of Diffusive Mass TransportDiffusion to Different Electrode Types (Planar, Cylindrical, Micro)Mass Transport of Chemically Interacting ParticlesCompetition of Diffusion and Ligand Exchange KineticsConcentration ProfilesLabile SystemsSystems With Limited LabilityPECULIARITIES OF ELECTROCHEMICAL PROCESSES INVOLVING LABILE COMPLEXESSteady-State VoltammogramsPotential TransientsCurrent TransientsQUANTITATIVE MODELLING OF QUASI-REVERSIBLE ELECTROCHEMICAL PROCESSES INVOLVING LABILE COMPLEXES OF METALSKinetic EquationsTafel Plots Normalized With Respect to the Surface Concentration of EACTechniques Based on the Control of the Intensity of Forced ConvectionIsosurface Concentration VoltammetryDetermination of the Exchange Current Density from Polarization ResistanceElectrochemical Impedance Spectroscopy Under Forced Convection ConditionsDETERMINATION OF MECHANISM OF ELECTROCHEMICAL PROCESSES INVOLVING METAL COMPLEXESIntroduction: General Reaction MechanismsDetermination of the Mechanism According to VetterMethod of Isopotential SolutionsADSORPTIONThermodynamic AspectsModel AspectsELECTROCHEMICAL PROCESSES IN REAL SYSTEMSExperimental DetailsCyanide SystemsSystem Cu|Cu(I), CN-System Ag|Ag(I), CNSystem Au|Au(I), CNEcological Systems Containing Hydroxy AcidsElectroreduction of Cu(II) ComplexesElectroreduction of Sn(II) ComplexesElectroreduction of Zn(II) ComplexesELECTROCHEMICAL DEPOSITION OF ALLOYSGeneral ConceptsMass
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TransportDistribution of Species at the Electrode SurfaceEffects of the Underpotential DepositionCodeposition of Cobalt and TinDeposition of Brass CoatingsPartial ProcessesCodeposition of Copper and ZincDeposition of Bronze CoatingsSurface Activity of Polyethers on Copper and Tin SubstratesEffect of HalidesEffect of Length of the Hydrocarbon ChainCodeposition of Copper and TinRELATED PHENOMENASpontaneous Formation of Photosensitive Oxide LayersTwo Mechanisms of Cu2O FormationElectrochemical Reduction of Oxide LayersPhotoelectrochemical Properties of Oxide LayersPhotoelectrochemical Stability of Oxide LayersEffect of Semiconducting Layers on Cu(II) ReductionHydrogen Evolution Involving Ligands As Proton DonorsCurrent OscillationsCONCLUDING REMARKS
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Autoren-Porträt von Arvydas Survila
Arvydas Survila is head researcher at the Center for Physical Sciences and Technology in Vilnius, Lithuania. Having obtained his academic degrees from Moscow State University, he spent most of his career working as professor at Vilnius University and Vytautas Magnus University (Kaunas). Simultaneously, he was the Head of Department of Electrochemical Kinetics at the Institute of Chemistry (Vilnius). Professor Survila has authored about 300 scientific publications. He obtained the prestigious Lithuanian Scientific Award (physical sciences) and J. Matulis Award from Lithuanian Academy of Science. He is also member of the International Society of Electrochemistry and of the Advisory Board of the Russian Journal of Electrochemistry.
Bibliographische Angaben
- Autor: Arvydas Survila
- 2015, XVI Seiten, 100 Schwarz-Weiß-Abbildungen, Maße: 17,2 x 24,9 cm, Gebunden, Englisch
- Verlag: Wiley-VCH
- ISBN-10: 3527338772
- ISBN-13: 9783527338771
- Erscheinungsdatum: 27.05.2015
Sprache:
Englisch
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