Failure Analysis of Integrated Circuits
Tools and Techniques
(Sprache: Englisch)
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
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This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Inhaltsverzeichnis zu „Failure Analysis of Integrated Circuits “
Preface. 1. Introduction; L.C. Wagner. 2. Electrical Characterization; S. Frank, et al. 3. Package Analysis: SAM and X-Ray; T.M. Moore, C. Hartfield. 4. Die Exposure; P.D. Ngo. 5. Global Failure Site Isolation: Thermal Techniques; D.L. Barton. 6. Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques; E.I. Cole, D.L. Barton. 7. Probing Technology for IC Diagnosis; C.G. Talbot. 8. Deprocessing; D. Yim. 9. Cross-Section Analysis; T. Haddock, S. Boddicker. 10. Inspection Techniques; L.C. Wagner. 11. Chemical Analysis; L.C. Wagner. 12. Energy Dispersive Spectroscopy; P.D. Ngo. 13. Auger Electron Spectroscopy; R.K. Lowry. 14. Secondary Ion Mass Spectrometry, SIMS; K. Evans. 15. Failure Analysis Future Requirements; D.P. Vallett. Index.
Bibliographische Angaben
- 1999, 276 Seiten, Maße: 16 x 24,1 cm, Gebunden, Englisch
- Herausgegeben: Lawrence C. Wagner
- Verlag: Springer US
- ISBN-10: 0412145618
- ISBN-13: 9780412145612
- Erscheinungsdatum: 31.01.1999
Sprache:
Englisch
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