Failure Modes And Mechanisms In Electronic Packages
(Sprache: Englisch)
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the...
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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Inhaltsverzeichnis zu „Failure Modes And Mechanisms In Electronic Packages “
Introduction. Electronic packaging. Why failures occur. Failure detection. Failure analysis. Failure modes. Failure mechanisms. Failure models. Failure preventions. Summary. Appendices. References.
Bibliographische Angaben
- Autoren: Puligandla Viswanadham , Pratap Singh
- 1997, 1998., 370 Seiten, Maße: 23,5 cm, Gebunden, Englisch
- Verlag: Springer Netherlands
- ISBN-10: 0412105918
- ISBN-13: 9780412105913
Sprache:
Englisch
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