Introduction to System-on-Package (SOP)
(Sprache: Englisch)
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a...
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Klappentext zu „Introduction to System-on-Package (SOP) “
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Inhaltsverzeichnis zu „Introduction to System-on-Package (SOP) “
Chapter 1. Introduction to the System-on-Package (SOP) TechnologyChapter 2. Introduction to System-on-Chip (SOC)
Chapter 3. Stacked ICs and Packages (SIP)
Chapter 4. Mixed-Signal (SOP) Design
Chapter 5. Radio Frequency System-on-Package (RF SOP)
Chapter 6. Integrated Chip-to-Chip Optoelectronic SOP
Chapter 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components
Chapter 8. Mixed-Signal Reliability
Chapter 9. MEMS Packaging
Chapter 10. Wafer-Level SOP
Chapter 11. Thermal SOP
Chapter 12. Electrical Test of SOP Modules and Systems
Chapter 13. Biosensor SOP
Index
Bibliographische Angaben
- Autoren: Rao R. Tummala , Madhavan Swaminathan
- 2008, 785 Seiten, Maße: 0,3 cm, Gebunden, Englisch
- Verlag: McGraw-Hill Professional
- ISBN-10: 0071459065
- ISBN-13: 9780071459068
Sprache:
Englisch
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