Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz
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(Sprache: Englisch)
This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its...
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This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.
Klappentext zu „Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz “
This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.
Bibliographische Angaben
- Autor: Akanksha Bhutani
- 2019, 254 Seiten, mit Abbildungen, Maße: 14,8 x 21 cm, Kartoniert (TB), Englisch
- Verlag: KIT Scientific Publishing
- ISBN-10: 3731509458
- ISBN-13: 9783731509455
- Erscheinungsdatum: 22.10.2019
Sprache:
Englisch
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