Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, Volume 3

Using Remendable Polymers for Aerospace Composite Structures.- Study of the Effect of Interface Enthalpy on Nanocomposite Viscoelasticity.- Sterilization Effect on Structure, Thermal and Time-dependent Properties of Polyamides.- Microstructural Evolution of Nafion During Uniaxial Deformation Monitored by X-ray Scattering.- Coupled Non-fickian Diffusion and Large Deformation of Hydrogels.- Accelerated Testing Methods for Oxidative Aging of Polymeric Composites.- Degradation of Shape Memory Polymer Due to Water and Diesel Fuels.- Structural Enhancement of Framing Members Using Polyurea.- Keynote Presentation (40 minutes).- Experiments and Models for the Time Dependent Mechanics of Nanoscale Polymeric Structures and Nanocrystalline Metal Films.- Study of Damage Evolution in High Strength Al Alloys Using X-ray Tomography.- Corrosion Behavior of SS 304 With Ball Milling and Electrolytic Plasma Treatment in NaCl Solution.- Experimental Studies of Phase Transformation in Shape Memory Alloys.- Measurement of Energy Loss in Thin Films Using Microbeam Deflection Method.- Multiscale Characterization of Water-, Oil- and UV-conditioned Shape-memory Polymer Under Compression.- Shape Memory Polymer Based Cellular Materials.- Influence of Mechanical Properties and Loading Conditions on the Recovery of Shape Memory Polymers.- Fatigue Cycling of Shape Memory Polymer Resin.- Higher Rate Testing of Long Fiber Filled Polypropylene.- Characterization of Elastomeric Composite Materials for Blast Mitigation.- Experimental Arrangement for Measuring the High-strain-rate Response of Polymers Under Pressures.- Simulation of Impact Tests on Polycarbonate at Different Strain Rates and Temperatures.- Experimental Investigation of Dynamic Mechanical Properties of Polyurea-fly Ash Composites.- Damage & Fracture of High-explosive Mock Subject to Cyclic Loading.- An Evaluation of A Modified Iosipescu Specimen for Measurement Of Elastic-plastic-creep Properties of Solder Materials.- Temperature Effect