Microchip Fabrication
(Sprache: Englisch)
With a new chapter on nanotechnology and new sections on 300mm wafer processing, "Microchip Fabrication" has been updated to reflect the latest processing techniques.
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With a new chapter on nanotechnology and new sections on 300mm wafer processing, "Microchip Fabrication" has been updated to reflect the latest processing techniques.
Inhaltsverzeichnis zu „Microchip Fabrication “
From the contents:The Semiconductor Industry International Technology Roadmap for Semiconductors Semiconductor Materials and Process Chemicals Manufacturing Wafers Overview of Wafer Fabrication 300mm wafer diameter processing Contamination Control Process Yields Nanotechnology Processes Oxidation Basic Patterning - Surface Preparation to Exposure Basic Patterning - Developing to Final Inspection Advanced Photolithography Processes Doping Deposition of Dielectrics and Semiconductor Layers Metalization: Wiring the Chip Composites Process and Device Evaluation The Business of Water Fabrication Green Processing Semiconductor Devices and Integrated Circuit Formation Nanotechnology Devices Integrated Circuit Types Packaging GLOSSARY
Autoren-Porträt von Peter Van Zant
Peter Van Zant is the Principal of Peter Van Zant Associates, a semiconductor manufacturing consulting and training company, and the author of all three previous editions of this widely read book. He has over 35 years in the semiconductor industry, working at IBM, Texas Instruments, and National Semiconductors. He resides in Grass Valley, California.
Bibliographische Angaben
- Autor: Peter Van Zant
- 2004, 5th ed., 642 Seiten, mit zahlreichen Abbildungen, Maße: 16,1 x 2,6 cm, Gebunden, Englisch
- Verlag: McGraw-Hill Professional
- ISBN-10: 0071432418
- ISBN-13: 9780071432412
Sprache:
Englisch
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