Microsystem Design
(Sprache: Englisch)
It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book's publication will mark an important milestone in the continuing worldwide development of...
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Klappentext zu „Microsystem Design “
It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book's publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer - one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.
Inhaltsverzeichnis zu „Microsystem Design “
ForewordPreface
Acknowledgments
Part I: Getting Started
1. Introduction
2. An Approach to MEMS Design
3. Microfabrication
4. Process Integration
Part II: Modeling Strategies
5. Lumped Modeling
6. Energy-Conserving Transducers
7. Dynamics
Part III: Domain-Specific Details
8. Elasticity
9. Structures
10. Energy Methods
11. Dissipation and the Thermal Energy Domain
12. Lumped Modeling of Dissipative Processes
13. Fluids
Part IV: Circuit and System Issues
14. Electronics
15. Feedback Systems
16. Noise
Part V: Case Studies
17. Packaging
18. A Piezoresistive Pressure Sensor
19. A Capacitive Accelerometer
20. Electrostatic Projection Displays
21. A Piezoelectric Rate Gyroscope
22. DNA Amplification
23. A Microbridge Gas Sensor
Appendices:
A. Glossary of Notation
B. Electromagnetic Fields
C. Elastic Constants in Cubic Material
References
Index
Bibliographische Angaben
- Autor: Stephen D. Senturia
- 1st ed. 2000. Corr. 2nd printing 2004, 720 Seiten, Maße: 16 x 24,1 cm, Gebunden, Englisch
- Verlag: Springer US
- ISBN-10: 0792372468
- ISBN-13: 9780792372462
- Erscheinungsdatum: 08.12.2004
Sprache:
Englisch
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