Microwave Plasma Sources and Methods in Processing Technology
(Sprache: Englisch)
A practical introduction to microwave plasma for processing applications at a variety of pressures
In Microwave Plasma Sources and Methods in Processing Technology, the authors deliver a comprehensive introduction to microwaves and...
In Microwave Plasma Sources and Methods in Processing Technology, the authors deliver a comprehensive introduction to microwaves and...
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Klappentext zu „Microwave Plasma Sources and Methods in Processing Technology “
A practical introduction to microwave plasma for processing applications at a variety of pressuresIn Microwave Plasma Sources and Methods in Processing Technology, the authors deliver a comprehensive introduction to microwaves and microwave-generated plasmas. Ideal for anyone interested in non-thermal gas discharge plasmas and their applications, the book includes detailed descriptions, explanations, and practical guidance for the study and use of microwave power, microwave components, plasma, and plasma generation.
This reference includes over 130 full-color diagrams to illustrate the concepts discussed within. The distinguished authors discuss the plasmas generated at different levels of power, as well as their applications at reduced, atmospheric and higher pressures. They also describe plasmas inside liquids and plasma interactions with combustion flames.
Microwave Plasma Sources and Methods in Processing Technology concludes with an incisive exploration of new trends in the study and application of microwave discharges, offering promising new areas of study.
The book also includes:
* A thorough introduction to the basic principles of microwave techniques and power systems, including a history of the technology, microwave generators, waveguides, and wave propagation
* A comprehensive exploration of the fundamentals of the physics of gas discharge plasmas, including plasma generation, Townsend coefficients, and the Paschen curve
* Practical discussions of the interaction between plasmas and solid surfaces and gases, including PVD, PE CVD, oxidation, sputtering, evaporation, dry etching, surface activation, and cleaning
* In-depth examinations of microwave plasma systems for plasma processing at varied parameters Perfect for researchers and engineers in the microwave community, as well as those who work with plasma applications, Microwave Plasma Sources and Methods in Processing Technology
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will also earn a place in the libraries of graduate and PhD students studying engineering physics, microwave engineering, and plasmas.
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Inhaltsverzeichnis zu „Microwave Plasma Sources and Methods in Processing Technology “
Foreword from the Authors ix1 Basic Principles and Components in the Microwave Techniques and Power Systems 1
1.1 History in Brief - From Alternating Current to Electromagnetic Waves and to Microwaves 1
1.2 Microwave Generators 3
1.3 Waveguides and Electromagnetic Modes in Wave Propagation 5
1.3.1 The Cut-off Frequency and the Wavelength in Waveguides 7
1.3.2 Waveguides Filled by Dielectrics 9
1.3.3 Wave Impedance and Standing Waves in Waveguides 10
1.3.4 Coaxial Transmission Lines 12
1.3.5 Microwave Resonators 14
1.4 Waveguide Power Lines 14
1.4.1 Magnetron Tube Microwave Generator 16
1.4.2 Microwave Insulators 16
1.4.3 Impedance Tuners 17
1.4.4 Directional Couplers 19
1.4.5 Passive Waveguide Components - Bends, Flanges, Vacuum Windows 20
1.4.6 Tapered Waveguides and Waveguide Transformers 22
1.4.7 Power Loads and Load Tuners 23
1.4.8 Waveguide Phase Shifters 25
1.4.9 Waveguide Shorting Plungers 25
1.4.10 Coupling from Rectangular to Circular Waveguide: Resonant Cavities for Generation of Plasma 26
1.5 Microwave Oven - A Most Common Microwave Power Device 28
References 33
2 Gas Discharge Plasmas 37
2.1 Basic Understanding of the Gas Discharge Plasmas 37
2.2 Generation of the Plasma, Townsend Coefficients, Paschen Curve 40
2.3 Generation of the Plasma by AC Power, Plasma Frequency, Cut-off Density 43
2.4 Space-charge Sheaths at Different Frequencies of the Incident Power 50
2.5 Classification of Gas Discharge Plasmas, Effects of Gas Pressure, Microwave Generation of Plasmas 55
2.5.1 Classification of Gas Discharge Plasmas 55
2.5.2 Effects of the Gas Pressure on Particle Collisions in the Plasma 58
2.5.3 Microwave Generation of Plasmas 61
References 64
3 Interactions of
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Plasmas with Solids and Gases 67
3.1 Plasma Processing, PVD, and PE CVD 67
3.2 Sputtering, Evaporation, Dry Etching, Cleaning, and Oxidation of Surfaces 72
3.3 Particle Transport in Plasma Processing and Effects of Gas Pressure 75
3.3.1 Movements of Neutral Particles 76
3.3.2 Movements of Charged Particles 77
3.3 Effect of the Gas Pressure on the Plasma Processing 79
3.4 Afterglow and Decaying Plasma Processing 81
References 83
4 Microwave Plasma Systems for Plasma Processing at Reduced Pressures 85
4.1 Waveguide-Generated Isotropic and Magnetoactive Microwave Plasmas 85
4.1.1 Waveguide-Generated Isotropic Microwave Oxygen Plasma for Silicon Oxidation 87
4.1.2 ECR and Higher Induction Magnetized Plasma Systems for Silicon Oxidation 93
4.2 PE CVD of Silicon Nitride Films in the Far Afterglow 105
4.3 Microwave Plasma Jets for PE CVD of Films 111
4.3.1 Deposition of Carbon Nitride Films 115
4.3.2 Surfajet Plasma Parameters and an Arrangement for Expanding the Plasma Diameter 119
4.4 Hybrid Microwave Plasma System with Magnetized Hollow Cathode 122
References 129
5 Microwave Plasma Systems at Atmospheric and Higher Pressures 135
5.1 Features of the Atmospheric Plasma and Cold Atmospheric Plasma (CAP) Sources 136
5.2 Atmospheric Microwave Plasma Sources Assisted by Hollow Cathodes 140
5.2.1 Applications of the H-HEAD Plasma Source in Surface Treatments 144
5.3 Microwave Treatment of Diesel Exhaust 151
5.4 Microwave Plasma in Liquids 154
5.5 Microwave Plasma Interactions with Flames 157
5.6 Microwave Plasmas at Ver
3.1 Plasma Processing, PVD, and PE CVD 67
3.2 Sputtering, Evaporation, Dry Etching, Cleaning, and Oxidation of Surfaces 72
3.3 Particle Transport in Plasma Processing and Effects of Gas Pressure 75
3.3.1 Movements of Neutral Particles 76
3.3.2 Movements of Charged Particles 77
3.3 Effect of the Gas Pressure on the Plasma Processing 79
3.4 Afterglow and Decaying Plasma Processing 81
References 83
4 Microwave Plasma Systems for Plasma Processing at Reduced Pressures 85
4.1 Waveguide-Generated Isotropic and Magnetoactive Microwave Plasmas 85
4.1.1 Waveguide-Generated Isotropic Microwave Oxygen Plasma for Silicon Oxidation 87
4.1.2 ECR and Higher Induction Magnetized Plasma Systems for Silicon Oxidation 93
4.2 PE CVD of Silicon Nitride Films in the Far Afterglow 105
4.3 Microwave Plasma Jets for PE CVD of Films 111
4.3.1 Deposition of Carbon Nitride Films 115
4.3.2 Surfajet Plasma Parameters and an Arrangement for Expanding the Plasma Diameter 119
4.4 Hybrid Microwave Plasma System with Magnetized Hollow Cathode 122
References 129
5 Microwave Plasma Systems at Atmospheric and Higher Pressures 135
5.1 Features of the Atmospheric Plasma and Cold Atmospheric Plasma (CAP) Sources 136
5.2 Atmospheric Microwave Plasma Sources Assisted by Hollow Cathodes 140
5.2.1 Applications of the H-HEAD Plasma Source in Surface Treatments 144
5.3 Microwave Treatment of Diesel Exhaust 151
5.4 Microwave Plasma in Liquids 154
5.5 Microwave Plasma Interactions with Flames 157
5.6 Microwave Plasmas at Ver
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Autoren-Porträt von Ladislav Bardos, Hana Barankova
Ladislav Bárdoa is Professor at the Department of Electrical Engineering at Uppsala University. He received his PhD from the Institute of Plasma Physics at the Czech Academy of Sciences in 1978 and DrSc from the Charles University Prague in 1995. He was awarded the Plasma Physics Innovation Prize 2019 by the European Physical Society.Hana Baránková is Professor at the Department of Electrical Engineering, Uppsala University. She received her PhD from the Institute of Radio Engineering and Electronics at the Czech Academy of Sciences in 1981. She was awarded the Plasma Physics Innovation Prize 2019 by the European Physical Society. She is Secretary of the Board of Directors at the Society of Vacuum Coaters in the US.
Bibliographische Angaben
- Autoren: Ladislav Bardos , Hana Barankova
- 2022, 1. Auflage, 208 Seiten, Maße: 15,7 x 23,5 cm, Gebunden, Englisch
- Verlag: Wiley & Sons
- ISBN-10: 111982687X
- ISBN-13: 9781119826873
- Erscheinungsdatum: 03.02.2022
Sprache:
Englisch
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