Reliability of Electronic Components

techniques.- 8.10 Failure mechanisms.- References.- 9 Reliability of Memories.- 9.1 Introduction.- 9.2 Process-related reliability aspects.- 9.3 Possible memories classifications.- 9.4 Silicon On Insulator (SOI) technologies.- 9.5 Failure frequency of small geometry memories.- 9.6 Causes of hardware failures.- 9.7 Characterisation testing.- 9.8 Design trends in microprocessor domain.- 9.9 Failure mechanisms of microprocessors.- References.- 10 Reliability of Optoelectronics.- 10.1 Introduction.- 10.2 LED reliability.- 10.3 Optocouplers.- 10.4 Liquid crystal displays.- References.- 11 Noise and Reliability.- 11.2 Excess noise and reliability.- 11.3 Popcorn noise.- 11.4 Flicker noise.- 11.5 Noise figure.- 11.6 Improvements in signal quality of digital networks.- References.- 12 Plastic Package and Reliability.- 12.1 Historical development.- 12.2 Package problems.- 12.3 Some reliabilistic aspects of the plastic encapsulation.- 12.4 Reliability tests.- 12.5 Reliability predictions.- 12.6 Failure analysis.- 12.7 Technological improvements.- 12.8 Can we use plastic encapsulated microcircuits (PEM) in high reliability applications?.- References.- 13 Test and Testability of Logic Ics.- 13.1 Introduction.- 13.2 Test and test systems.- 13.3 Input control tests of electronic components.- 13.4 LIC selection and connected problems.- 13.5 Testability of LICs.- 13.6 On the testability of electronic and telecommunications systems.- References.- 14 Failure Analysis.- 14.1 Introduction [14.1]...[14.25].- 14.2 The purpose of failure analysis.- 14.3 Methods of analysis.- 14.4 Failure causes.-14.5 Some examples.- References.- 15 Appendix.- 15.1 Software-package RAMTOOL++ [15.1].- 15.2 Failure rates for components used in telecommunications.- 15.3 Failure types for electronic components [15.2].- 15.4 Detailed failure modes for some components.- 15.5 Storage reliability data [15.3].- 15.6 Failure criteria. Some examples.- 15.7 Typical costs for the screening of plastic encapsulated ICs.- 15.8 Results of 1000 h HTB life tests for CMOS microprocessors.- 15.9 Results of 1000 h HTB life tests for linear circuits.- 15.10 Average values of the failure rates for some IC families.- 15.11 Activation energy values for various technologies.- 15.12 Failures at burn-in.- References.- General Bibliography.- Reliability Glossary.- List of Abbreviations.- Polyglot Dictionary of Reliability Terms.