Technology of Polymer Packaging

1 Definition of Polymers
2 Manufacturing of Polymer Resins
3 Classification of Polymers (Plastics)
4 Plastics Additives
5 Required Performances of a Plastic Packaging
6 Polymers for Packaging
7 Legislative aspects for Polymers
8 Extruder - Polymer melting machine
8.1 Technology of Extrusion and Co-extrusion
8.2 Conti-Process
8.2.1 Manufacturing of blown film (flexible films)
8.2.2 Manufacturing of cast films
8.2.2.1 Chillroll-films (flexible films)
8.2.2.2 Calendering of sheets (rigid sheets)
8.2.2.3 Water bath Sheets
8.2.2.4 PVC-Sheets
8.2.3 Tubes as Packaging material
8.2.4 Special films
8.2.4.1 Monolayer Films
8.2.4.2 Multilayer films
8.2.4.3 Oriented films
8.2.4.4 Biaxial oriented films (sequentially and simultaneously)
8.2.4.5 Double-Bubble Process
8.2.4.6 Tripple-Bubble Process
8.2.4.7 Shrink films
8.2.4.8 Stretch films
8.2.4.9 Extended films
8.3 Disconti-Process
8.3.1 Injection-Moulding
8.3.2 Injection-Blow-Moulding
8.3.3 Extrusion- and Coextrusion-Blow-Moulding
8.3.4 Stretch Blow-Moulding
8.3.5 Thermoforming
8.3.5.1 Processing of Polymer Sheets
8.3.5.2 Thermoforming Machines
9 Technology of Sealing
9.1 Direct Heating
9.1.1 Heated Jaw Sealing
9.1.2 Electrical Impuls Sealing
9.1.3 Hot Air Sealing
9.2 Indirect Heating
9.2.1 Highfrequency-Sealing
9.2.2 Ultrasonic Sealing
9.2.3 Induction-Sealing
Part 3: Converting of Polymer Packaging (Composite Packaging)
10 Technology of coating
10.1 Extrusion Coating
10.2 Coextrusion Coating
10.3 Lacquering
11 Laminating
11.1 Extrusion Laminating
11.2 Coextrusion Laminating
11.3 Adhesive Laminating
11.3.1 Solvent based Laminating
11.3.2 Solventless Laminating
12. Vacuum Deposition of Packaging Material
12.1 Material and Substrates
12.2 PVD-(Physical Vapour Deposition)
12.2.1 El. Resistance Heating
12.2.2 Electron Beam Gun
12.2.3 Plasma Deposition
12.3 CVD (Chemical Vapour Deposition)
12.3.1 Al- and Si-Oxides
12.3.2 Organic Siloxanes
Part 4: Special Topics
13

Dr.-Ing. Arabinda Ghosh has been Professor of Polymer Packaging at the University of Applied Sciences, Stuttgart, since 1991. He previously undertook research at the Fraunhofer Institute for Food- and Packaging Technology, Munich, and was Manager for Packaging System Development, Dixie Union, Kempten.