3D Integration in VLSI Circuits (PDF)

Katsuyuki Sakuma is a research staff member at the IBM T. J. Watson Research Center. Currently, he is also a Visiting Professor at the Department of Biomedical Engineering, Tohoku University, Japan. He has over 19 years of experience of researching 3D integration technologies and performing various semiconductor packaging research and development projects.

His research interests include 3D integration technologies, bonding technologies, and advanced packaging. He has published more than 85 peer-reviewed journal papers and conference proceeding papers, including three book chapters in the semiconductor and electronic packaging area. He also holds over 35 issued or pending U.S. and international patents. He has been recognized with the IBM Eleventh Invention Achievement Award in 2017 and an Outstanding Technical Achievement Award (OTAA) in 2015 for his contribution and leadership in the area of 3D integration technology development. He was also given the 2018 Exceptional Technical Achievement Award from IEEE Electronics Packaging Society and the 2017 Alumni Achievement Award from his Alma Mater, the School of Engineering at Tohoku University, for his contribution to 3D chip stack technology development in the electronics packaging industry. He was co-recipient of the IEEE CPMT Japan Society Best Presentation Award in 2012, and the IMAPS "Best of Track" Outstanding Paper Award in 2015.