Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (ePub)
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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
Ephraim Suhir is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE); the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE) and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored about 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including the 1996 Bell Labs Distinguished Member of Technical Staff Award and the 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering. He is the third Russian American, after Stephen Timoshenko and Igor Sikorsky, who received this prestigious award.
- Autor: Ephraim Suhir
- 2021, 406 Seiten, Englisch
- Verlag: Taylor & Francis
- ISBN-10: 0429863810
- ISBN-13: 9780429863813
- Erscheinungsdatum: 27.01.2021
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
- Dateiformat: ePub
- Größe: 7.78 MB
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