Hybrid Assemblies and Multichip Modules (PDF)

Name: Hybrid Assemblies and Multichip Modules
Brand: Taylor & Francis
SKU: 133733865
Price: 66.99 EUR
Availability: OnlineOnly

(Sprache: Englisch)

Autor: Kear

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Hybrid Assemblies and Multichip Modules, Kear

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Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of...

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Autoren-Porträt von Kear

Fred W. Kear is a manufacturing manager at Mototola Inc., in Albuquerque, New Mexico. He is the author of three books: The Design and Manufacture of Printed Circuits, Production Engineering, and Printed Circuit Assembly Manufacturing (Marcel Dekker, Inc.). A member of the Institute of Printed Circuits, Mr. Kear was also the chief contributor to the Sourcebook of Electronic Circuits, and contributing author to Tunnel Diodes and Semiconductor Circuits, Design Manual for Transistor Circuits, and Modem Digital Circuits. In addition, he has written approximately 200 technical papers that have been published in professional journals.