Introduction to Microsystem Packaging Technology (ePub)

Dr. Yufeng Jin received his Ph.D. degree in Electronical Engineering in March 1999 from Southeast University, Nanjing, China. Since then, he has been working as a postdoctoral fellow, an associate professor and a professor in Institute of Microelectronics, Peking University, China. Now he heads the National Key Laboratory of Science and Technology on Micro/Nano Fabrication at Peking University. From Nov. 2001 to Sept. 2004, he was a visiting research fellow in Singapore Institute of Manufacturing Technology for developing advanced MEMS packaging techniques. He worked with scientists and researchers in Applied Science and Technology Research Institute, HK as a consultant for 3D packaging development from Sept. to Nov. 2007. Current research interesting is mainly focused on advanced MEMS packaging, micro sensor, TSV-based 3D integration of microelectronics and its application systems.

Dr. Zhiping Wang received his D. Phil. degree in Engineering Science in March 1990 from Oxford University, UK. He had worked in Sheffield University, UK from March 1989 to April 1992. He then joined Singapore Institute of Manufacturing Technology, as research fellow, senior research fellow, and Group Manager for Joining Technology Group until August 2002, where he pioneered BGA, CSP, flip chip, and MEMS packaging technologies as well as interconnect reliability assessment methodology development. From September 2002 to June 2006, he worked in Industrial Technology Centre of Philips Mobile Display Systems as the Senior Manager of Module Technology, where he was responsible for display module technology development. He was the Chief Technology Officer of Advanpack Solutions Ptd Ltd in Singapore from Jun 2006 to Jan 2007. Since Feb 2007, he had been a Senior Scientist and the Programme Manager of Microfluidics Manufacturing Programme in Singapore Institute of Manufacturing Technology. His main interests are in the development of electronics

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