Reliability, Yield, and Stress Burn-In (PDF)
A Unified Approach for Microelectronics Systems Manufacturing & Software Development
(Sprache: Englisch)
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance...
sofort als Download lieferbar
Printausgabe 160.49 €
eBook (pdf) -7%
149.79 €
74 DeutschlandCard Punkte sammeln
- Lastschrift, Kreditkarte, Paypal, Rechnung
- Kostenloser tolino webreader
Produktdetails
Produktinformationen zu „Reliability, Yield, and Stress Burn-In (PDF)“
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: . the economic impact of employing the microelectronics fabricated by in dustry, . a study of the relationship between reliability and yield, . the progression toward miniaturization and higher reliability, and . the correctness and complexity of new system designs, which include a very significant portion of software.
Bibliographische Angaben
- Autoren: Way Kuo , Wei-Ting Kary Chien , Taeho Kim
- 2013, 1998, 394 Seiten, Englisch
- Verlag: Springer, New York
- ISBN-10: 1461556716
- ISBN-13: 9781461556718
- Erscheinungsdatum: 27.11.2013
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
eBook Informationen
- Dateiformat: PDF
- Größe: 49 MB
- Mit Kopierschutz
- Vorlesefunktion
Sprache:
Englisch
Kopierschutz
Dieses eBook können Sie uneingeschränkt auf allen Geräten der tolino Familie lesen. Zum Lesen auf sonstigen eReadern und am PC benötigen Sie eine Adobe ID.
Kommentar zu "Reliability, Yield, and Stress Burn-In"
0 Gebrauchte Artikel zu „Reliability, Yield, and Stress Burn-In“
Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
---|
Schreiben Sie einen Kommentar zu "Reliability, Yield, and Stress Burn-In".
Kommentar verfassen