WSPC Series in Advanced Integration and Packaging: Cost Analysis of Electronic Systems (ePub)
(Sprache: Englisch)
This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology...
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This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology development and management. This book melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems, return on investment, cost-benefit analysis, and real options analysis are addressed.
Bibliographische Angaben
- Autor: Peter Sandborn
- 2016, Englisch
- ISBN-10: 9813148268
- ISBN-13: 9789813148260
- Erscheinungsdatum: 15.12.2016
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
eBook Informationen
- Dateiformat: ePub
- Größe: 14 MB
- Mit Kopierschutz
Sprache:
Englisch
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