WSPC Series in Advanced Integration and Packaging: Solder Materials (ePub)

-->This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials. -->Sample Chapter(s)Chapter 1: Solder Products and Soldering Process -->Contents: Solder Products and Soldering ProcessSolder AlloysPhysical Metallurgy of Solder AlloysSolderability and Soldering ReactionSolid State Reactions of Solder Joints Induced by Thermal EnergySolid State Interactions Induced by ElectromigrationMechanical PropertiesReliability of Solder Joints --> -->Readership: It is a very informative book for those who are interested in learning the materials science of solders, in performing fundamental research, in carrying practical applications. -->Composite Solder;Creep;Drop Test;Electromigration;Eutectic;Failure Mode;Impact Test;Intermetallic;Kirkendall Void;Reliability;Shear Strength;Solderability;Tensile Strength;Thermal Cycling;Thermal Fatigue;Thermal Migration;Tin Whisker;Wetting Force0Key Features:Comprehensive overview of important solder subjectsCover important subjects of concern to research and industry applicationComprehensive documentation of literatures