3-Dimensional VLSI
A 2.5-Dimensional Integration Scheme
(Sprache: Englisch)
3-Dimensional VLSI presents a new integration scheme designed for problems that are difficult to solve with traditional non-monolithic integration schemes. Major 3-D VLSI design issues are also introduced, within an integrated framework.
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3-Dimensional VLSI presents a new integration scheme designed for problems that are difficult to solve with traditional non-monolithic integration schemes. Major 3-D VLSI design issues are also introduced, within an integrated framework.
Klappentext zu „3-Dimensional VLSI “
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
Inhaltsverzeichnis zu „3-Dimensional VLSI “
A Cost Comparison of VLSI Integration Schemes.- Design Case Studies.- An Automatic 2.5-D Layout Design Flow.- Floorplanning for 2.5-D Integration.- Placement for 2.5-D Integration.- A Road map of 2.5-D Integration.- Conclusion and Future Work.
Bibliographische Angaben
- Autoren: Yangdong Deng , Wojciech P. Maly
- 2010, 200 Seiten, Maße: 16,1 x 24,5 cm, Gebunden, Englisch
- Verlag: Tsinghua University Press
- ISBN-10: 3642041566
- ISBN-13: 9783642041563
- Erscheinungsdatum: 21.06.2010
Sprache:
Englisch
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