Advanced Wirebond Interconnection Technology
(Sprache: Englisch)
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality...
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Klappentext zu „Advanced Wirebond Interconnection Technology “
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
Inhaltsverzeichnis zu „Advanced Wirebond Interconnection Technology “
- Materials for Wire Bonding- Bonding Equipment
- Process Technology
- Quality
- Reliability
- New Technologies and New Applications for Wire Bonding
Bibliographische Angaben
- Autor: Shankara K. Prasad
- 2004, XXIX, 669 Seiten, Maße: 16,6 x 24,1 cm, Gebunden, Englisch
- Verlag: Springer Netherlands
- ISBN-10: 1402077629
- ISBN-13: 9781402077623
- Erscheinungsdatum: 30.04.2004
Sprache:
Englisch
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