Area Array Packaging Handbook
(Sprache: Englisch)
Area Array Packaging--consisting of the BGA, CSP, and Flip Chip packaging approaches--is a revolution in electronic manufacturing, featuring entirely new design, materials, and manufacturing processes. This book describes in the detail all three approaches:...
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Klappentext zu „Area Array Packaging Handbook “
Area Array Packaging--consisting of the BGA, CSP, and Flip Chip packaging approaches--is a revolution in electronic manufacturing, featuring entirely new design, materials, and manufacturing processes. This book describes in the detail all three approaches: design, packaging, construction, assembly, and application. The handbook will deal with the pros and cons of using each technology with varying application, deal in detail with the difficult packaging ramifications of HDI design concepts, and focus on critical reliability and testing issues.
Inhaltsverzeichnis zu „Area Array Packaging Handbook “
Forword Section 1: Packaging Concepts and Design Chapter 1: Introduction to Electronic Packaging Chapter 2: Electronics Industry Overview Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry Chapter 4: Area Array Packaging Chapter 5: Stacked/3D Packages Chapter 6: Compliant IC Packaging Chapter 7: Flip Chip Technology Chapter 8: Options in High-Density Part Cleaning Chapter 9: MEMS Packaging and Assembly Challenges Chapter 10: Ceramic Ball and Column Grid Array Overview Section 2: Materials Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills Chapter 12: Hermetic Packaging Systems: Adhesive and Getter Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes Chapter 14: Modern Solder and Solder Paste Chapter 15: Lead-Free Systems and Process Implications Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? Section 3: Equipment and Processes Chapter 17: Next-Generation Flip ChipMaterials and Processes Chapter 18: Flip Chip Assembly and Underfilling Chapter 19: BGA and CSP Rework: What is Involved? Chapter 20: BGA Assembly Reliability Chapter 21: Die Attach and Rework Chapter 22: Liquid Encapsulation Equipment and Processes Chapter 23: Molding for Area Array Packages Chapter 24: Screen Printing and Stenciling Chapter 25: Criteria for Placement and Processing of Advanced Packages Chapter 26: Ovens in Electronics Chapter 27: Process Development, Control, and Organization Section 4: Economics and Productivity Chapter 28: Metrics: The Key to Productivity Chapter 29: Cost Estimating for Electronic Assembly Section 5: Future Chapter 30: The Future of Electronic Packaging Chapter 31: The Future of SMT Process Equipment Index
Bibliographische Angaben
- 2002, mit zahlreichen Schwarz-Weiß-Abbildungen, mit zahlreichen Abbildungen, Maße: 24,5 cm, Gebunden, Englisch
- By Ken Gilleo
- Verlag: McGraw-Hill Professional
- ISBN-10: 0071374930
- ISBN-13: 9780071374934
Sprache:
Englisch
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