Characterization of Integrated Circuit Packaging Materials
(Sprache: Englisch)
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress,...
Leider schon ausverkauft
versandkostenfrei
Buch
96.51 €
48 DeutschlandCard Punkte
sammeln
- Lastschrift, Kreditkarte, Paypal, Rechnung
- Kostenlose Rücksendung
- Ratenzahlung möglich
Produktdetails
Produktinformationen zu „Characterization of Integrated Circuit Packaging Materials “
Klappentext zu „Characterization of Integrated Circuit Packaging Materials “
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find:General overview of IC package reliability testing
Characterization for the electrical performance of IC packages
Understanding surface characteristics and interfaces for thermal management
Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more
Autoren-Porträt von Thomas M. Moore, Robert G. McKenna
Thomas M. MooreRobert G. McKenna
Bibliographische Angaben
- Autoren: Thomas M. Moore , Robert G. McKenna
- 2010, 274 Seiten, Maße: 15,8 x 24 cm, Gebunden, Englisch
- Herausgegeben: C. Richard Brundle, Charles A. Evans
- Verlag: Momentum Press
- ISBN-10: 1606501879
- ISBN-13: 9781606501870
Sprache:
Englisch
Kommentar zu "Characterization of Integrated Circuit Packaging Materials"
0 Gebrauchte Artikel zu „Characterization of Integrated Circuit Packaging Materials“
| Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
|---|
Schreiben Sie einen Kommentar zu "Characterization of Integrated Circuit Packaging Materials".
Kommentar verfassen