Characterization of PDMS as Encapsulation for Implantable MEMS Systems
(Sprache: Englisch)
Modifications to a novel multi-layered polydimethylsiloxane (PDMS) encapsulation process that include improvements to the substrate cleaning procedure and roller casting application method were developed to produce a robust non-hermetic micropackage...
Leider schon ausverkauft
versandkostenfrei
Buch
54.90 €
27 DeutschlandCard Punkte
sammeln
- Lastschrift, Kreditkarte, Paypal, Rechnung
- Kostenlose Rücksendung
- Ratenzahlung möglich
Produktdetails
Produktinformationen zu „Characterization of PDMS as Encapsulation for Implantable MEMS Systems “
Klappentext zu „Characterization of PDMS as Encapsulation for Implantable MEMS Systems “
Modifications to a novel multi-layered polydimethylsiloxane (PDMS) encapsulation process that include improvements to the substrate cleaning procedure and roller casting application method were developed to produce a robust non-hermetic micropackage technology for chronic micro implant systems. Packaged interdigitated electrodes subjected to accelerated lifetime tests at 85 degree C in a saline environment had an average lifetime of 156.6 days, which exceeded the previous average lifetime by 22.3 days and suggests a packaging lifetime in the human body greater than 2 years and perhaps as long as 5 years. In order to understand the unexpectedly long lifetime, material characterization experiments were performed on PDMS films deposited by dip, spin and roller-casting. The results show that roller casting increases the mass density, decreases the vapor permeability, and increases bonding strength on FR4 PCB substrates by +2%, - 14%, +19%, respectively relative to the other deposition methods.
Bibliographische Angaben
- Autor: Di Sun
- 2014, 96 Seiten, Maße: 22 cm, Kartoniert (TB), Englisch
- Verlag: LAP Lambert Academic Publishing
- ISBN-10: 365956544X
- ISBN-13: 9783659565441
Sprache:
Englisch
Kommentar zu "Characterization of PDMS as Encapsulation for Implantable MEMS Systems"
0 Gebrauchte Artikel zu „Characterization of PDMS as Encapsulation for Implantable MEMS Systems“
| Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
|---|
Schreiben Sie einen Kommentar zu "Characterization of PDMS as Encapsulation for Implantable MEMS Systems".
Kommentar verfassen