Handbook of 3D Integration.Vol.1
Technology and Applications of 3D Integrated Circuits
(Sprache: Englisch)
With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.
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With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.
Klappentext zu „Handbook of 3D Integration.Vol.1 “
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Inhaltsverzeichnis zu „Handbook of 3D Integration.Vol.1 “
INTRODUCTION TO 3D INTEGRATIONDRIVER FOR 3D INTEGRATIONOverview of 3D Processing Technology
Fabrication of Through Silicon Vias (TSV)
Fabrication, Processing and Singulation of Thin Wafers
Wafer and Die Bonding Technology
3D INTEGRATION PROCESSES
Universities and InstitutesStart Up Companies
3D Commerical Roadmaps
DESIGN FOR 3D INTEGRATION
NC State
Fraunhofer
U Minn
ELECTRICAL PERFORMANCE AND TEST OF 3D CIRCUITS
Electrical Performance - Infineon
Test of 3D Circuits - Intel
THERMAL MANAGEMANT
Fraunhofer IZM
IBM Zurich
APPLICATION OF 3D INTEGRATION
3D Integratio for Next Generation Microprocessors
3D Memories
Sensor Arrays
TSV for Power Devices
CONCLUSIONS
Autoren-Porträt
Dr. Philip Garrou is a consultant in the field of thin film microelectronic materials and applications, prior to which he was Director of Technology and New Business Development for Dow Chemicals' Advanced Electronic Materials business. He has authored two microelectronics texts and is co-author of over 75 peer reviewed publications and book chapters.Dr. Christopher A. Bower is Senior Research Scientist at Semprius Inc., Durham, NC, where he works on the heterogeneous integration of compound semiconductors with silicon integrated cirucits. He previously held positions at Inplane Photonics as a senior process development engineer and as a scientist at RTI International, where he served as the technical lead on multiple DARPA-funded 3D integration programs. Dr. Bower has authored or co-authored over 40 peer-reviewed publications and holds 2 U.S. patents.
Dr. Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Reliability and Microintegration (IZM) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.
Bibliographische Angaben
- 2008, XXX, 670 Seiten, 330 farbige Abbildungen, Maße: 18,1 x 24,7 cm, Gebunden, Englisch
- Herausgegeben: Peter Ramm, Christopher Bower, Philip Garrou
- Verlag: Wiley-VCH
- ISBN-10: 3527320342
- ISBN-13: 9783527320349
- Erscheinungsdatum: 12.08.2008
Sprache:
Englisch
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