Handbook of Wafer Bonding

PrefaceINTRODUCTIONHistorical background: From BSOI Wafers to 3D ICs, From Glass Wafer Bonding to Hermetic Metal SealsClassification of Wafer Bonding Techniques: Intermediate Layers, Temperature, Technology HeadlineWafer Bonding Fundamentals: Bonding Theory, Bonding Conditions, Testing TechniquesChallenges for Wafer-to-Wafer and Chip-to-Wafer Bonding TECHNOLOGIESAdhesive Bonding: Glass Frit Bonding, Spin on Glass, PolymersAnodic Bonding: Double stacks, Triple Stacks, Thin Film Anodic BondingDirect Wafer Bonding: Fusion Bonding, Plasma-activated Bonding, Surface-activated BondingMetal Bonding: Eutectic Bonding, Thermo-compression / Thermo-sonic Bonding, SLID Bonding, Ni-Au µ-Inserts, Nano LawnHybrid Metal/Dielectric Bonding: Cu/BCB, CuSiO2, Ni/SiO2APPLICATIONSMEMS: Non-hermetic, Hermetic, Extremely Hermetic, Combined PossibilitiesBESOI/BSOI Wafer FabricationMIMOS for Integrated Sensors, Vacuum Applications3D IntegrationHandling of Thin Wafers/Dies, Temporary Bonding: Adhesive, Electrostatic

Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Peter Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing since more than two decades on 3D integration technologies. Peter Ramm is author or co-author of more than 100 publications and 23 patents. He received the "Ashman Award 2009" from the International Electronics Packaging Society (IMAPS) "For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies". Peter Ramm is organizing committee member of 3DIC conference and co-editor of Wiley¿s "Handbook of 3D Integration".James Jian-Qiang Lu received his Dr.rer.nat. (Ph.D.) degree from Technical University of Munich in December 1995, and is currently an Associate Professor in Electrical Engineering at Rensselaer Polytechnic Institute (RPI), Troy, NY. At RPI, Dr. Lu has worked on 3D hyper-integration technology, design and applications for more than decade, with focus on hyper-integration and micro-nano-bio interfaces for future chips. He has more than 200 publications in the areas from micro-nano-electronics theory and design to materials, processing, devices, integration and packaging. He served as technical chair, workshop chair, session chair, panelist and panel moderator for many conferences. He is an IEEE Fellow for contributions to three-dimensional integrated circuit technology, and a Fellow and Life Member of International Microelectronics and Packaging Society (IMAPS). He is a member of APS, MRS and ECS. He has served as the 3D Packaging Chair of the IMAPS National Technical Committee since 2006. He is a recipient of the