High-Bandwidth Memory Interface
(Sprache: Englisch)
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis,...
Voraussichtlich lieferbar in 3 Tag(en)
versandkostenfrei
Buch (Kartoniert)
74.89 €
Produktdetails
Produktinformationen zu „High-Bandwidth Memory Interface “
Klappentext zu „High-Bandwidth Memory Interface “
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
Inhaltsverzeichnis zu „High-Bandwidth Memory Interface “
An introduction to high-speed DRAM.- An I/O Line Configuration and Organization of DRAM.- Clock generation and distribution.- Transceiver Design.- TSV Interface for DRAM.
Bibliographische Angaben
- Autoren: Chulwoo Kim , Hyun-Woo Lee , Junyoung Song
- 2013, 2014, VIII, 88 Seiten, 41 farbige Abbildungen, Maße: 15,4 x 23,9 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 3319023802
- ISBN-13: 9783319023809
Sprache:
Englisch
Kommentar zu "High-Bandwidth Memory Interface"
0 Gebrauchte Artikel zu „High-Bandwidth Memory Interface“
Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
---|
Schreiben Sie einen Kommentar zu "High-Bandwidth Memory Interface".
Kommentar verfassen