Managing Heat Generation in Electronic Devices
(Sprache: Englisch)
This introduction to heat transfer theory on a graduate level links the experimental with theory, so as to highlight the connections between these two approaches. Divided into three parts on heat transport in electronic devices and materials, materials for...
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This introduction to heat transfer theory on a graduate level links the experimental with theory, so as to highlight the connections between these two approaches.
Divided into three parts on heat transport in electronic devices and materials, materials for solid-state heat conduction, and active cooling technology, this monograph also treats the Boltzmann transport equation and atomic-level simulation. Also includes a look at possible future technologies, including novel materials and composites, thermoelectrics, and microrefrigerators.
Klappentext zu „Managing Heat Generation in Electronic Devices “
This introduction to heat transfer theory on a graduate level links the experimental with theory, so as to highlight the connections between these two approaches.Divided into three parts on heat transport in electronic devices and materials, materials for solid-state heat conduction, and active cooling technology, this monograph also treats the Boltzmann transport equation and atomic-level simulation. Also includes a look at possible future technologies, including novel materials and composites, thermoelectrics, and microrefrigerators.
Inhaltsverzeichnis zu „Managing Heat Generation in Electronic Devices “
Managing Heat Generation in Electronic DevicesPart I. Heat transport in electronic devices and materials
1. Overview of heat management in electronics
2. Solid-state heat conduction
3. Interfacial thermal transport4
. Transport in confined geometries
5. Non-equilibrium heat transport in electronics
6. Thermal transport simulation
Part II. Materials for solid-state heat conduction
7. Silicon-on-insulator and Si/SiGe technology
8. Composite substrates
9. Heat spreaders and heat sinks
10. Thermal-Interface Materials (TIMS)
11. Interconnects and passivation
Part III. Active cooling technology
12. Gas-compression based refrigeration
13. Thermoelectric/thermionic refrigeration
14. Microfluidics and phase-change devices
Autoren-Porträt
Patrick Schelling received his Ph.D. in Physics from the University of Minnesota in 1999. From 1999 to 2003, he held a postdoctoral position at Argonne National Laboratory, where the principle focus of his work was to study thermal transport using atomic-scale simulation. A key contribution of his work was to develop new methods that reveal detailed phonon scattering processes in the course of a molecular-dynamics simulation. In 2003, he joined the faculty as an assistant professor in the Advanced Materials Processing and Analysis Center (AMPAC) and the Department of Physics at the University of Central Florida. His research interests are quite diverse but share a common theme of atomic-scale modeling. The main focus of his research is to elucidate thermal transport in semiconductor materials in new regimes and length scales where bulk Fourier-Law behavior breaks down. He also maintains an active research program in the application of electronic-structure methods to problems in catalysis and electrochemistry.
Bibliographische Angaben
- 2009, 400 Seiten, 16 farbige Abbildungen, 100 Schwarz-Weiß-Abbildungen, Maße: 17 cm, Gebunden, Englisch
- Ed. by Patrick Schelling
- Herausgegeben: Patrick Schelling
- Verlag: Wiley-VCH
- ISBN-10: 3527407197
- ISBN-13: 9783527407194
Sprache:
Englisch
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