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Study of Atomic Layer Deposited HfO2/Si Interfaces

For their Quality Reliability and Radiation based Interface Modifications (Sprache: Englisch)
 
 
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To continue scaling of MOS devices, SiO2 has to be replaced by high-K dielectric material. HfO2 is one of the prime materials with high dielectric constant has the potential to replace SiO2. HfO2 has been extensively studied by a number of authors. Still...
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