Wire Bonding in Microelectronics
(Sprache: Englisch)
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been...
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Klappentext zu „Wire Bonding in Microelectronics “
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics. Wire Bonding in Microelectronics, Second Edition equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Third Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping,
Inhaltsverzeichnis zu „Wire Bonding in Microelectronics “
Introduction to Third Edition; Acknowledgments; Introduction to CD; Chapter 1. The Technical Introduction to the Third Edition; Chapter 2. Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism; Chapter 3. Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing; Chapter 4. Wire Bond Testing; Chapter 5. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding; Chapter 6. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability; Chapter 7. Cleaning to Improve Bondability and Reliability; Chapter 8. Mechanical Problems in Wire Bonding; Chapter 9. Advanced and Specialized Wire Bonding Technologies; Chapter 10. An Overview of the Materials and Material Science of Copper, Low-k Devices that Affect Bonding and Packaging; Chapter 11. Wire Bonding Process Modeling and Simulation; Glossary ; Bibliography ; Index
Autoren-Porträt von George Harman
George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.
Bibliographische Angaben
- Autor: George Harman
- 3., Auflage, XX, 426 Seiten, mit Abbildungen, Maße: 16,1 x 24 cm, Gebunden, Englisch
- Verlag: McGraw-Hill Professional
- ISBN-10: 0071476237
- ISBN-13: 9780071476232
- Erscheinungsdatum: 01.03.2010
Sprache:
Englisch
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