Advances in Chemical Mechanical Planarization (CMP) (ePub)

(Sprache: Englisch)
 
 
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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink....
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Bestellnummer: 140225094

eBook (ePub) 250.00
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