Hybrid Assemblies and Multichip Modules (ePub)

Name: Hybrid Assemblies and Multichip Modules
Brand: Taylor & Francis
SKU: 133733808
Price: 66.99 EUR
Availability: OnlineOnly

(Sprache: Englisch)

Autor: Kear

Schreiben Sie einen Kommentar zu "Hybrid Assemblies and Multichip Modules".

Hybrid Assemblies and Multichip Modules, Kear

Merken

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of...

Mehr zum Inhalt Autorenporträt Video

Leider schon ausverkauft

Bestellnummer: 133733808

eBook (ePub) 66.99 €

Download bestellen

Verschenken

33 DeutschlandCard Punkte sammeln

Lastschrift, Kreditkarte, Paypal, Rechnung
Kostenloser tolino webreader

Produktdetails

Produktbeschreibung
Autorenporträt
eBook Hilfe
Biblio. Angaben / Produktdetails

Produktinformationen zu „Hybrid Assemblies and Multichip Modules (ePub)“

Autoren-Porträt von Kear

Fred W. Kear is a manufacturing manager at Mototola Inc., in Albuquerque, New Mexico. He is the author of three books: The Design and Manufacture of Printed Circuits, Production Engineering, and Printed Circuit Assembly Manufacturing (Marcel Dekker, Inc.). A member of the Institute of Printed Circuits, Mr. Kear was also the chief contributor to the Sourcebook of Electronic Circuits, and contributing author to Tunnel Diodes and Semiconductor Circuits, Design Manual for Transistor Circuits, and Modem Digital Circuits. In addition, he has written approximately 200 technical papers that have been published in professional journals.