Physical Design for 3D Integrated Circuits (ePub)
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This book reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. Featuring contributions from renowned experts in their respective fields, this comprehensive reference provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Chuan Seng Tan holds a BEng in electrical engineering from the University of Malaya, Malaysia; an MEng in advanced materials from the National University of Singapore; and a PhD in electrical engineering from the Massachusetts Institute of Technology, Cambridge. He has been a research engineer with the Institute of Microelectronics, Singapore; an Applied Materials Graduate Fellow; and an intern at Intel Corporation, Oregon. He is currently an associate professor at Nanyang Technological University, Singapore, where he previously served as a Lee Kuan Yew Postdoctoral Fellow and an inaugural Nanyang Assistant Professor. Widely published, Dr. Tan participates in several international conference committees and is a member of the IEEE. He has edited three and co-authored two books, and serves as an associate editor for Elsevier Microelectronics Journal.
- 2017, 415 Seiten, Englisch
- Herausgegeben: Aida Todri-Sanial, Chuan Seng Tan
- Verlag: Taylor & Francis
- ISBN-10: 1351830198
- ISBN-13: 9781351830195
- Erscheinungsdatum: 19.12.2017
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- Dateiformat: ePub
- Größe: 10 MB
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