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Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement (PDF)

(Sprache: Englisch)
 
 
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As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward....

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Bestellnummer: 112415372

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