Solder Joint Technology / Springer Series in Materials Science Bd.92 (PDF)
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of...
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The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
- Autor: King-Ning Tu
- 2007, 2007, 370 Seiten, Englisch
- Verlag: Springer-Verlag GmbH
- ISBN-10: 0387388923
- ISBN-13: 9780387388922
- Erscheinungsdatum: 27.07.2007
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
- Dateiformat: PDF
- Größe: 12 MB
- Ohne Kopierschutz
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