Metal - Semiconductor Contacts and Devices (PDF)
(Sprache: Englisch)
VLSI Electronics Microstructure Science, Volume 13: Metal-Semiconductor Contacts and Devices presents the physics, technology, and applications of metal-semiconductor barriers in digital integrated circuits. The emphasis is placed on the interplay among the...
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VLSI Electronics Microstructure Science, Volume 13: Metal-Semiconductor Contacts and Devices presents the physics, technology, and applications of metal-semiconductor barriers in digital integrated circuits. The emphasis is placed on the interplay among the theory, processing, and characterization techniques in the development of practical metal-semiconductor contacts and devices.
This volume contains chapters that are devoted to the discussion of the physics of metal-semiconductor interfaces and its basic phenomena; fabrication procedures; and interface characterization techniques, particularly, ohmic contacts. Contacts that involve polycrystalline silicon; applications of the metal-semiconductor barriers in MOS, bipolar, and MESFET digital integrated circuits; and methods for measuring the barrier height are covered as well.
Process engineers, device physicists, circuit designers, and students of this discipline will find the book very useful.
This volume contains chapters that are devoted to the discussion of the physics of metal-semiconductor interfaces and its basic phenomena; fabrication procedures; and interface characterization techniques, particularly, ohmic contacts. Contacts that involve polycrystalline silicon; applications of the metal-semiconductor barriers in MOS, bipolar, and MESFET digital integrated circuits; and methods for measuring the barrier height are covered as well.
Process engineers, device physicists, circuit designers, and students of this discipline will find the book very useful.
Bibliographische Angaben
- Autoren: Simon S. Cohen , Gennady Sh. Gildenblat
- 2014, 434 Seiten, Englisch
- Herausgegeben: Norman G. Einspruch
- Verlag: Elsevier Science & Techn.
- ISBN-10: 1483217795
- ISBN-13: 9781483217796
- Erscheinungsdatum: 01.12.2014
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