Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
(Sprache: Englisch)
This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
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This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
Klappentext zu „Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs “
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable. Inhaltsverzeichnis zu „Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs “
Introduction.- Wafer Stacking and 3D Memory Test.- Built-in Self-Test for TSVs.- Pre-Bond TSV Test Through TSV Probing.- Pre-Bond TSV Test Through TSV Probing.- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths.- Post-Bond Test Wrappers and Emerging Test Standards.- Test-Architecture Optimization and Test Scheduling.- Conclusions.
Autoren-Porträt von Brandon Noia, Krishnendu Chakrabarty
Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.
Bibliographische Angaben
- Autoren: Brandon Noia , Krishnendu Chakrabarty
- 2014, 2014, XVIII, 245 Seiten, 115 farbige Abbildungen, Maße: 16,2 x 24,3 cm, Gebunden, Englisch
- Verlag: Springer, Berlin
- ISBN-10: 3319023772
- ISBN-13: 9783319023779
- Erscheinungsdatum: 09.12.2013
Sprache:
Englisch
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