Metallized Plastics 3
Fundamental and Applied Aspects
(Sprache: Englisch)
This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October...
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This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October 13-18, 1991. This series of symposia to address the subject of metallized plastics was initiated in 1988 and the premier symposium was held in Chicago, October 10-12, 1988, followed by the second event in Montreal, Canada, May 7-10, 1990. The rroceedings of these two symposia have been properly documented ,2. The third symposium was a huge success like the previous two events, and all this is testimonial to the brisk interest and high tempo of R&D activity in the fie14 of metallized plastics. This further bolsters our earlier thinking that there was a conspicuous need to hold symposia on this topic on a regular basis and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. The study of metallized plastics constitutes an important human endeavor l and as pointed out earlier there are myriad applications of metallized plastics ranging from very commonplace to exotic. Also a survey of the recent literature will reveal that both the fundamental and applied aspects of metallized plastics are being pursued with great vigor.
Inhaltsverzeichnis zu „Metallized Plastics 3 “
I. Metallization Techniques and Properties of Metal Deposits.- The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards.- Photoselective Circuitization of Dielectrics Via Electroless Plating of Metals.- Plasma-Induced Deposition of Copper Films.- The Effects of Substrate Functional Groups on Conventional and Novel E1ectroless Catalysts.- Laser Speckle Detection of Surface Morphology in Molded Plastic Parts.- Development of a Generic Method to Metallize Plastics.- Palladium and Aluminum Thin Film Deposition on Thermally Sensitive Substrates from Organometallic Complexes.- Application of Metallized Plastic Electrodes for Electrowinning of Metals.- II. Investigation of Interfacial Interactions.- Model Studies of the Interface Between Metals and Polyimides.- Scanning Tunneling Microscopy of Metal/Polymer Interfaces.- "In Situ" XPS Investigation of Polymers Metallized by Evaporation.- Model Systems for the Cr/Polyimide Interface.- Interactions of Deposited Copper on COOH of 11-Mercaptoundecanoic Acid: An XPS Study.- XPS Investigation of the Interfacial Chemistry of Evaporated Silver on Plasma-Modified Polystyrene.- The Chemistry of Metal/Polymer Interface Formation: Relevance to Adhesion.- III. Plastic Surface Modifications.- A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment.- Influence of Surface Treatments on the Metallization of Thermostable Polymers.- Oxygen Plasma Treatment of Fluorinated Polyimide: An X-ray Photoelectron Spectroscopy Study.- A Static SIMS Study of the Chemical Modifications Induced by Plasma and Flame Treatments at the Surface of Polyolefins.- Aluminium Metallization of Polypropylene Films Pretreated by a N2 or NH3 Nonequilibrium Plasma. Study of the Interface and Adhesion Measurements.-Aluminum Metallization of Polyimide Substrate.- IV. Adhesion Aspects of Metallized Plastics.- Adhesion Enhancement Using Ion Processing: Metallized Plastics.- The Influence of the Pretreatment on the Adhesion of
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Metallic Coatings on Plastics.- Effect of the Polymeric Substrate Temperature on the Adhesion and Morphology of Metal Layers.- An Electrochemical Means of Probing a Metal/Polymer Interface- -A Method for Deducing Mechanical and Chemical Adhesion Components.- Measurement and Control of Interface Strength and Mechanical Properties of Coatings by Laser Spallation Experiment.- The Adhesion Strength of Metal/Polyimide and Polyimide/Silicon Interfaces as Determined by the Blister Test.- Non-destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy.- About the Contributors.
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Bibliographische Angaben
- 1993, 1992, IX, 400 Seiten, Maße: 17,8 x 25,4 cm, Gebunden, Englisch
- Herausgegeben: Kashmiri L. Mittal, K.L. Mittal
- Verlag: Springer, Berlin
- ISBN-10: 0306443414
- ISBN-13: 9780306443411
Sprache:
Englisch
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