Packaging of High Power Semiconductor Lasers
(Sprache: Englisch)
This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.
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This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.
Klappentext zu „Packaging of High Power Semiconductor Lasers “
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Inhaltsverzeichnis zu „Packaging of High Power Semiconductor Lasers “
Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
Autoren-Porträt von Hui Liu, Xingsheng Liu, Lingling Xiong, Wei Zhao
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
Bibliographische Angaben
- Autoren: Hui Liu , Xingsheng Liu , Lingling Xiong , Wei Zhao
- 2014, 2015, XV, 402 Seiten, 386 farbige Abbildungen, Maße: 16 x 24,1 cm, Gebunden, Englisch
- Verlag: Springer, Berlin
- ISBN-10: 1461492629
- ISBN-13: 9781461492627
- Erscheinungsdatum: 15.07.2014
Sprache:
Englisch
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