Precision Assembly Technologies for Mini and Micro Products: Proceedings of the Ifip Tc5 Wg5.5 Third International Precision Assembly Seminar (Ipas'20
(Sprache: Englisch)
These contributions to the 3rd IPAS'2006 seminar are grouped in 6 sections. Part 1 reviews new techniques for handling and feeding micro parts. Micro-robotics and robot applications for micro assembly are discussed in Part 2. An overview of different design...
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Produktinformationen zu „Precision Assembly Technologies for Mini and Micro Products: Proceedings of the Ifip Tc5 Wg5.5 Third International Precision Assembly Seminar (Ipas'20 “
These contributions to the 3rd IPAS'2006 seminar are grouped in 6 sections. Part 1 reviews new techniques for handling and feeding micro parts. Micro-robotics and robot applications for micro assembly are discussed in Part 2. An overview of different design and planning applications for microassembly is provided in Part 3. Part 4 covers reconfigurable and modular micro assembly systems and control applications. The economic aspects of microassembly including new business models are discussed in Part 5 while Part 6 presents specific technical solutions and microassembly applications.
Inhaltsverzeichnis zu „Precision Assembly Technologies for Mini and Micro Products: Proceedings of the Ifip Tc5 Wg5.5 Third International Precision Assembly Seminar (Ipas'20 “
- Design of a Capillary Gripper for a Submillimetric Application- Design and Experimental Evaluation of an Electrostatic Micro-Gripping System
- A Generic Approach for a Micro Parts Feeding System
- Pneumatic Contactless Feeder for Microassembly
- Methods for Comparing Servo Grippers for Mini and Micro Assembly Applications
- Compliant Parallel Robots
- Sensor Guided Micro Assembly by Using Laser-Scanning Technology
- Automated Assembly Planning Based on Skeleton Modelling Strategy
- First Steps in Integrating Micro-Assembly Features into Industrially used DFA Software
- The Importance of Concept and Design Visualization in the Production of an Automated Assembly and Test Machine
- Miniature Reconfiguarable Assembly Line for Small Products
- Conception of a Scalable Production for Micro-Mechatronical Products
- Towards an Integrated Assembly Process Decomposition and Modular Equipment Configuration
- Precision Multi-Degrees-Of-Freedom Positioning Systems
- Impact of Bad Components on Costs and Productivity in Automatic Assembly
- Laser Sealed Packaging for Microsystems
- Microhandling and Assembly: the Project ASSEMIC
Bibliographische Angaben
- Autor: S. Ratchev
- 2006, 336 Seiten, Maße: 15,6 x 23,4 cm, Gebunden, Englisch
- Herausgegeben: Svetan Ratchev
- Verlag: Springer, Berlin
- ISBN-10: 0387312765
- ISBN-13: 9780387312767
Sprache:
Englisch
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