Reliability of MEMS
Testing of Materials and Devices
(Sprache: Englisch)
This edition of CMOS-MEMS was originally published in the successful series Advanced Micro & Nanosystems . A close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefi ts of three-dimensional silicon
processing.
processing.
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Produktdetails
Produktinformationen zu „Reliability of MEMS “
This edition of CMOS-MEMS was originally published in the successful series Advanced Micro & Nanosystems . A close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefi ts of three-dimensional silicon
processing.
processing.
Klappentext zu „Reliability of MEMS “
This edition of CMOS-MEMS was originally published in the successful series Advanced Micro & Nanosystems . A close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefi ts of three-dimensional siliconprocessing. An insider s view of industrial MEMS commercialization is followed by chapters on capacitive interfaces for MEMS, packaging issues of micro- and nanosystems, MEMS contributions to high frequency integrated resonators and filters, and the uses of MEMS in mass
data storage and electrochemical imaging by means of scanning micro- and nanoprobes.
The second section on nanodevices first tackles the emerging topic of nanofluidics with a contribution each on simulation tools and on devices and uses, followed by another two on nanosensors featuring CNT sensors and CMOS-based DNA sensor arrays, respectively.
Inhaltsverzeichnis zu „Reliability of MEMS “
Evaluation of Mechanical Properties of MEMS Materials and Their Standardization Elastoplastic Indentation Contact Mechanics of Homogeneous Materials and Coating-Substrate Systems Thin film Characterization Using the Bulge Test Uniaxial Tensile Test for MEMS Materials On-chip Testing of MEMS Reliability of a Capacitive Pressure Sensor Inertial Sensors High-Accuracy, High-Reliability MEMS Accelerometer Reliability of MEMS Variable Optical Attenuator Reliability of MEMS Variable Optical Attenuator (pages 239-266) Eco Scan MEMS Resonant Mirror
Autoren-Porträt
Osamu Tabata is Professor in the Department of Microengineering at Kyoto University. He received his MSc and PhD degrees from Nagoya Institute of Technology. From 1981 to 1996, he performed industrial research at Toyota Central Research and Development Laboratories in Aichi, Japan. He joined the Department of Mechanical Engineering of Ritsumeikan University in Shiga, Japan, in 1996, and the Department of Mechanical Engineering at Kyoto University in 2003. Osamu Tabata is engaged in the research of micro/nano processes, MEMS and micro/nano system synthetic engineering. He received numerous awards, including the Science News Award and the Research & Development Top 100 Award in 1993 and 1998.Toshiyuki Tsuchiya is Assistant Professor in the Department of Microengineering at Kyoto University. He received his PhD from Nagoya University, Japan, in 2002. From 1993 to 2004, he carried out industrial research at Toyota Central Research and Development Laboratories in Aichi, Japan. In 2004, he joined the Department of Mechanical Engineering of Kyoto University. Toshiyuki Tsuchiya's current research is focused on mechanical properties evaluation of micro/nano materials and MEMS and micro/nano system synthetic engineering.
Bibliographische Angaben
- 2013, XX, 304 Seiten, 204 Schwarz-Weiß-Abbildungen, 204 Abbildungen, Maße: 17,1 x 24,1 cm, Kartoniert (TB), Englisch
- Herausgegeben: Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata, Toshiyuki Tsuchiya
- Verlag: Wiley-VCH
- ISBN-10: 3527335013
- ISBN-13: 9783527335015
- Erscheinungsdatum: 23.04.2013
Sprache:
Englisch
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